ICP Etcher (DRIE Etcher) [PDF : 400KB]

• Bulk/ Poly silicon etching (MEMS and NANO)
  
• Dialectrics etching (SiO₂, Si₃N₄, etc)
  
• Compound semiconductors etching (GaAs, GaN, etc)
  
• Polymide etching

PECVD (PES Series) [PDF : 400KB]

• Poly silicon deposition
  
• Silicon oxide deposition
  
• Silicon nitride deposition
  
• Metal oxide deposition
  

RIE (URS Series) [PDF : < 400KB]

• Silicon etching
  
• Dialectrics etching (SiO₂, Si₃N₄, etc)
• Polymide etching

Plasma Immersion Ion Implantation (Impulse Series) [PDF : < 420KB]

• Ultra-Shallow Junction Doping for sub-100 nm CMOS
• Conformal doping of non-planar CMOS and other electronic devices
• Poly-Si Gate & Trench Sidewall doping
• Gate Dialectric Modification
• Layer transfer technology for "SOI", "Si- On Anything" and other

Spray and Spin Coater (SPC Series)   [PDF : < 400KB]

• Uniform coating of topography such as V-grooves and trenches
  
• Photo resist coating
  
• Spin-On-Glass
• Organic Materials