• Single-piece chamber construction
• 1,000W, 13.56MHz RF ICP Power
• 600W, 13.56 MHz RF Bias Power
• Auto RF matching
• Downstream pressure control
• Computer control with Windows 2000 operating software
• Pumping: Mechanical and turbo pumps for etching; mechanical pump with roots blower for deposition
• Field proven components
• Proven process recipes
• Endpoint detection (optional)