&#8226; &nbsp; <strong>DRIE (Deep Reactive Etch)</strong><br />
&#8226; &nbsp; High rate and low damage etching<br />
&#8226; &nbsp; Submicron etching<br />
&#8226; &nbsp; Polyimide etching<br />
&#8226; &nbsp; Passivation etching<br />
&#8226; &nbsp; <strong>Trench etch</strong><br />
&#8226; &nbsp; PECVDSiO2 and Si3N4<br />
&#8226; &nbsp; Low temperature-low damage<br />
&#8226; &nbsp; Carbon nano-tube deposition<br />
&#8226; &nbsp; DLC