&#8226; &nbsp; Failure analysis applications<br />
&#8226; &nbsp; Material modification<br />
&#8226; &nbsp; Adhesion promotion Plasma descum<br />
&#8226; &nbsp; Surface treatment<br />
&#8226; &nbsp; Anisotropic and isotropic etching<br />
&#8226; &nbsp; Metal etching<br />
&#8226; &nbsp; Si02, Si3N4 and SiOxNy deposition<br />
&#8226; &nbsp; III-V etching applications<br />
&#8226; &nbsp; Trench etching<br />
&#8226; &nbsp; Passivation etching<br />
&#8226; &nbsp; Polyimide etching<br />
&#8226; &nbsp; Submicron etching