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Etch & Deposition Products |
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Axic
low cost plasma, XRF
PLASMASTAR 200
- Reactive ION Etcher / Photoresist Stripper / Plasma Surface Cleaning
MULTIMODE HF-8 - ELECTRODE CONFIGURATIONS
BENCHMARK 800-II
BENCHMARK 800-III ICP ( < 100 KB) 
Ultech
ICP, RIE, sputtering system, e-beam and thermal evaporators, ALD, MOCVD, plasma
immersion implanter, and others
ICP Etcher (DRIE Etcher) [PDF : 400KB]
- Bulk/ Poly silicon etching (MEMS and NANO)
- Dialectrics etching (SiO2, Si3N4, etc)
- Compound semiconductors etching (GaAs, GaN, etc)
- Polymide etching
PECVD (PES Series) [PDF : 400KB]
- Poly silicon deposition
- Silicon oxide deposition
- Silicon nitride deposition
- Metal oxide deposition
RIE (URS Series) [PDF : < 400KB]
- Silicon etching
- Dialectrics etching (SiO2, Si3N4, etc)
- Polymide etching
Plasma Immersion Ion Implantation (Impulse Series) [PDF : < 420KB]
- Ultra-Shallow Junction Doping for sub-100 nm CMOS
- Conformal doping of non-planar CMOS and other electronic devices
- Poly-Si Gate & Trench Sidewall doping
- Gate Dialectric Modification
- Layer transfer technology for "SOI", "Si- On Anything" and other
Spray and Spin Coater (SPC Series) [PDF : < 400KB]
- Uniform coating of topography such as V-grooves and trenches
- Photo resist coating
- Spin-On-Glass
- Organic Materials
Secon
Wafer Backside Thinning
- High Rate Microwave Plasma Wafer Backside Thinning Tool
XCD-790 [PDF : < 700KB]
- Dry chemical plasma etcher for diode and solar substrate processing
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